High-performance electronics cooling system

ABSTRACT

A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.

RELATED APPLICATIONS

The present application is a divisional of, and claims priority to, U.S.patent application Ser. No. 15/797,996, titled “HIGH-PERFORMANCEELECTRONICS COOLING SYSTEM,” and filed on Oct. 30, 2017, the entirecontents of which are hereby incorporated by reference for all purposes.

BACKGROUND

Cooling systems are traditionally used to dissipate heat generated byelectronic circuit packages, such as an integrated circuit die package.Heat pipes and vapor chambers are components of such cooling systems. Inaddition, liquid cooling solutions are also used to transfer heatgenerated by such electronic circuit packages (ECPs). As ECPmanufacturers develop advanced microprocessors for high-performanceprocessing and computing applications, new advances in ECP coolingsolutions are needed to adequately manage the increased heat that isgenerated by these more advanced components.

SUMMARY

According to one aspect, the disclosure relates to a cooling system foran electronic circuit package. The cooling system includes a heattransfer plate positioned in thermal contact with an electronic circuitpackage surface. The heat transfer plate forms a bottom surface of anevaporative region of the cooling system. The cooling system furtherincludes a plurality of condensing tubes in fluid communication with,and extending away from, the evaporative region. The evaporative regionand condensing tubes together form a single, uninterrupted, sealedenclosure. The cooling system further includes a fluid disposed withinthe sealed disclosure. The cooling system further includes a pluralityof spacers substantially filling gaps between the heat transfer plateand respective condensing tubes. Each of the spacers is configured as anindependent component to allow the passage of fluid through an interiorspace of each spacer. The cooling system further includes a plurality ofwicks. Each wick is positioned partially within a corresponding spacerto which the spacer is fluidically coupled.

In some implementations, at a least a portion of each wick contacts theheat transfer plate. In some implementations, the portion of each wickin contact with the heat transfer plate is oriented substantiallyparallel to the heat transfer plate. In some implementations, theportion of each wick in contact with the heat transfer plate covers lessthan three-quarters of a cross sectional area of an end of acorresponding spacer. In some implementations, the portion of each wickin contact with the heat transfer plate substantially covers an end ofits corresponding spacer and extends in a direction parallel to the heattransfer plate beyond an edge of the corresponding spacer. In someimplementations, each wick comprises a metal mesh. In someimplementations, each spacer extends at least partially into acorresponding condensing tube. In some implementations, an inner surfaceof each condensing tube defines a plurality of grooves. In someimplementations, the heat transfer plate comprises a plurality of finsextending away from the heat transfer plate within the sealed enclosure.In some implementations, the plurality of fins are arranged in anirregular fashion. In some implementations, the plurality of fins arearranged based on a variation in heat generation across the electroniccircuit package surface in thermal contact with the heat transfer plate.In some implementations, at least a portion of the sealed enclosure iscoated with a copper powder. In some implementations, the copper powdercoating the sealed enclosure has a particle size of about 0.1 mm. Insome implementations, the copper powder coating the sealed enclosureforms a coating having a thickness of about 0.3 mm. In someimplementations, the copper powder coating coats a plurality of finsextending away from the heat transfer plate within the sealed enclosure.In some implementations, the copper powder coating coats at least one ofthe heat transfer plate and a surface of the evaporative region oppositethe heat transfer plate within the sealed enclosure. In someimplementations, the interiors of the condensing tubes are free from thecopper powder coating. In some implementations, a diameter of eachspacer flares outward proximate to the heat transfer plate. In someimplementations, a portion of each spacer extends closer to the coolingplate than a remainder of the spacer. In some implementations, thecondensing tubes are positioned about a perimeter of the sealedenclosure.

According to another aspect, the disclosure relates to a cooling systemfor an electronic circuit package. The cooling system includes a heattransfer plate positioned in thermal contact with an electronic circuitpackage surface. The heat transfer plate forms a bottom surface of anevaporative region of the cooling system. The cooling system furtherincludes a plurality of condensing tubes in fluid communication with,and extending away from, the evaporative region. The evaporative regionand condensing tubes together form a single, uninterrupted, sealedenclosure. Each of the plurality of condensing tubes includes aplurality of grooves. The cooling system further includes a fluiddisposed within the sealed disclosure. The cooling system includes aplurality of wicks. Each wick is positioned such that one end is incontact with the heat transfer plate and an opposite end extends into aproximal end of a corresponding condensing tube for a distance that isless than 5% of the length of the corresponding condensing tube. In someimplementations, each wick comprises a multi-layer copper mesh.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and related objects, features, and advantages of the presentdisclosure will be more fully understood by reference to the followingdetailed description, when taken in conjunction with the followingfigures, wherein:

FIG. 1 is a diagram of an example electronic circuit package coolingsystem.

FIGS. 2A-2G describe multiple example configurations of spacers andwicks suitable for use in an electronic circuit package cooling systemaccording to some implementations.

FIG. 3 is a top view of the example electronic circuit package coolingsystem illustrating an example arrangement of condensing tubes in anelectronic circuit package cooling system according to someimplementations.

FIG. 4 is a diagram of the electronic circuit package cooling systemillustrating an example arrangement of grooved condensing tubes in anelectronic circuit package cooling system according to someimplementations.

FIGS. 5A and 5B are diagrams of example configurations of fins suitablefor incorporation into an electronic circuit package cooling systemaccording to some implementations.

FIGS. 6 and 7 are diagrams of example coating configurations within theevaporative region of an electronic circuit package cooling systemaccording to some implementations.

FIG. 8 is a diagram of an example coating configuration within thecondensing region of an electronic circuit package cooling systemaccording to some implementations.

DETAILED DESCRIPTION

Heat dissipation is a major concern for manufacturers of electroniccircuit packages, such as an integrated circuit die package. Asmanufacturers create electronic circuit packages (ECPs) with greatercomputing and processing capabilities, the need for improved coolingsolutions also increases in order for users to gain the full benefit ofthese high-performance electronic circuit designs without being hinderedby performance degradations due to sub-optimal management of heat thatis generated by the more powerful ECP. Heat pipes and vapor chambershave often been used in this domain to cool ECPs. Typically, in legacysolutions, as ECP power increases, the cooling performance declinesbecause the solutions are unable to dissipate enough heat at a fastenough rate to ensure optimal performance of the ECP. Often the coolingcapacity of a particular heat pipe or vapor chamber design does notmatch the heat generation profile of a given ECP for which the coolingsolution has been applied. As a result, temperatures in the ECP risewhich can degrade ECP performance and/or negatively impact the life-spanand reliability of the ECP. Cooling solutions that include liquidcooling methods are available but often involve increased cost anddesign complexity. The cooling systems disclosed herein can avoid theexpensive design, manufacturing, and maintenance requirements that aretypically associated with liquid cooling solutions. The disclosedcooling systems are also well-suited for deployment with high-powercomponents (e.g., processors performing computationally intensiveoperations, such as machine learning applications) and may enable use ofhigher processor speeds to increase chip performance.

The disclosed cooling systems include a number of features to improveheat transfer away from an ECP to which the cooling system is attached.These features, alone and/or in combination, can help enable theevaporation process to be improved, and in some cases optimized, for aparticular heat source, resulting in more efficient and consistent heattransfer away from high power density ECPs. The disclosed coolingsystems may include a single continuous liquid-vapor chamber. Thechamber may include an evaporator plate, which is in contact with theECP and transfers heat into a liquid coolant that is included in thechamber. The liquid coolant may then evaporate as heat is absorbed fromthe ECP and the moisture vapor generated from the evaporating liquid mayaccumulate in the condensing tubes. In the condensing tubes, the heatcontained in the moisture vapor may be transferred to the condensingtube walls and consequently to an external cooling medium (which mayinclude water or air, or other fluids). The liquid condensate thataccumulates on the inner surface of the condensing tube walls may thenflow back to the evaporative region from the condensing tubes. Thecooling system can include independent structures, referred to herein asspacers that fluidically couple the condensing tubes to the evaporativeregion. Such spacers may include a rigid component and/or a wick, toprovide a continuous flow of liquid coolant for more efficient heattransfer. The spacer may act as a “bridge” between the end of thecondensing tubes closest to the evaporator plate (referred to as the“proximal end”) and the heat transfer plate of the evaporative portionof the chamber. The wicks may provide a wicking effect, drawing thecondensate liquid from the condensing tubes back down into theevaporative portion of the chamber, rather than allowing the liquid toaccumulate in the proximal end of the condensing tubes and drip downinto the evaporator plate.

As an additional feature, the inner walls of the evaporative portion ofthe chamber may include surface coatings to improve evaporationefficiency. For example, a copper powder may coat the heat transferplate and the surfaces of the chamber that are opposite the heattransfer plate. In some implementations, the surface coating may alsocoat the walls of the chamber and/or the inner walls of the condensingtubes. In some implementations, the inner walls of the condensing tubeslack a surface coating, and instead include a series of longitudinalgrooves that extend the length of the condensing tubes.

In some implementations, the wick may include a multi-layer copper meshextending between the condensing tubes and the heat transfer plate. Inaddition, fins may also be added to the internal surface of the heattransfer plate to increase the surface area of the heat transfer plate.The fins may also be coated with a copper coating to boost theevaporative efficiency of the cooling system.

The heat transfer plate may be attached to an upper portion of thechamber to form an enclosed, single-volume, continuous liquid-vaporcooling system. The condensing tubes may be connected to the sides ofthis enclosed chamber or to the top (or a combination of both connectionconfigurations). As described above, the condensing tubes may include awick to provide a capillary effect and improve fluid circulation betweenthe evaporative and condensing regions of the chamber. Alternatively orin addition, the condensing tubes may include grooves to reduce thefriction of the condensate on the condensing tube inner walls and mayfacilitate movement of the condensate back to the evaporative region.

The disclosed cooling system architecture enhances the air coolingcapacity of the condensing tubes and addresses the problem of managinghigh heat flux that is typically generated by high power ASICs ormicroprocessors. Often, the configuration of high power processorsincluded in an ECP can greatly affect the heat transfer performance ofthe cooling system used to cool the ECP. A solution to this problem mayinclude a cooling system that is optimized for the configuration orlayout of the high-performance components that are included in aparticular ECP configuration. For example, an ECP configuration may bearranged such that numerous microprocessors are positioned around theperimeter of the ECP. A cooling system that includes design elements inthe center of the ECP may not demonstrate the same heat transfercapabilities as a cooling system configured with heat transfer featuresthat are similarly mapped or positioned in relation to the heatgenerating components of the ECP, such as cooling system features thatare configured around the perimeter of the cooling system in positionscorresponding to the heat generating processors of the ECP. One way thedisclosed cooling systems disclosed herein address this problem is byenabling an ECP manufacturer to customize the shape, elevation anddensity of a plurality of fins that may be arranged on the heat transferplate that is coupled to the ECP. The fins may be arranged in a uniformpattern or an irregular pattern that is designed to optimize the heattransfer away from the heat generating portions of the ECP over whichthe fins are located. In the disclosed cooling system, regions of theECP with a greater density of heat-generating ASICs or microprocessorsmay be mapped and a heat transfer plate may be manufactured with aplurality of fins whose location, density and coating properties may beoptimized to efficiently manage the heat generated by themicroprocessors. For example, regions of the heat transfer plate locatedabove components of an ECP that generate greater amounts of heat may beinclude a greater number of fins, a greater fin surface area, or agreater fin density (and thus greater heat transfer capacity) thanregions of the heat transfer plate located above lower-poweredintegrated circuits in the ECP over which the heat transfer plate islocated.

Additional details of the various design elements included in thedisclosed cooling system will now be described in more detail.

FIG. 1 is a diagram of an example electronic circuit package coolingsystem 105. In broad overview, the cooling system 105 is coupled to anelectronic circuit package (ECP) 110, such as an integrated circuit diepackage. The ECP 110 may further include one or more microprocessors,such as ASICs, field programmable gate arrays (FPGAs), ormicroprocessors. The cooling system 105 also includes a heat transferplate 115. The cooling system includes an evaporative region 120 and aplurality of condensing regions 125. The cooling system 105 includes aplurality of condensing tubes 130 and a plurality of spacers 135. Thecooling system 105 also includes a plurality of wicks 140.

As shown in FIG. 1, the cooling system 105 is formed as a single,uninterrupted, sealed enclosure or chamber. The cooling system 105includes a heat transfer plate 105 forming the bottom or lower portionof the chamber and a plurality of condensing tubes 130 forming an upperportion of the chamber. The cooling system 105 includes an evaporativeregion 120 and a plurality of condensing regions 125, located within thecondensing tubes 130. The upper portion of the chamber may be fitted asa lid to the lower portion of the chamber to create the single,continuous volume chamber. In some implementations, the chamber mayinclude a liquid (e.g., water or a coolant fluid) to absorb the heatthat is generated by the ECP 110. The generated heat is absorbed by theliquid within the evaporative region 120 and transferred to thecondensing region 125 as the liquid evaporates. The evaporated liquid istransferred to the condensing tubes 130 as vapor where, as the vaporcondenses on the walls of the condensing tubes 130, the heat isdissipated through the walls of the condensing tubes 130 into anexternal cooling medium surrounding the condensing tubes 130, such asair or water or another fluid. The condensate may then flow from thewalls of the condensing tubes 130 back to the evaporative region 120.

The design of the single, continuous volume liquid-vapor chamber of thecooling system 105 may provide the benefit of allowing all thecondensing tubes 130 to operate at the same temperature (assuming equalvapor pressure inside). In this way, the condensing tubes 130, whenconnected to the same chamber or volume of space (e.g., the evaporativeregion 120) and exposed to the lower temperature liquid present in theevaporative region 120, may transfer a higher heat load than if thecondensing tubes 130 were not connected to the same chamber or volume ofspace or were otherwise located downstream of the liquid coolant. Thus,a single, continuous volume liquid-vapor chamber avoids uneven heatbalancing among the condensing tubes 130 and further avoids intermediatethermal resistances, such as solder thermal resistance and/or copperheat spreader resistance that may form between the heat transfer plate115 and the external cooling medium, e.g., air or water, in coolingsystem designs which include multiple internal chambers or heatdissipation structures.

As shown in FIG. 1, a heat transfer plate 110 is coupled to the ECP 105.The heat transfer plate 105 is positioned directly atop and mated to anECP 105 so that heat generated by ECP 105 may be transmitted to the heattransfer plate 110 for further dissipation. The heat transfer plate 110may be constructed of a metal or metal alloy possessing superior heattransfer qualities, such as copper or aluminum, so that the heat that isgenerated by the ECP 105 is efficiently transferred to the heat transferplate 110 and into the cooling system 105 for further dissipation. Theheat transfer plate 115 forms the lower portion or floor of the chamberformed by the cooling system 105. In some implementations, the heattransfer plate 115 may be coupled to the ECP 110 using a thermaltransfer material.

As shown in FIG. 1, the cooling system 105 includes an evaporativeregion 120. The evaporative region 120 receives the heat generated bythe ECP 110 and transferred to the heat transfer plate 115 to which itis coupled. The evaporative region 120 is the volume of space formed byheat transfer plate 115, the walls, and upper portion of the chamber ofthe cooling system 105. The evaporative region 120 may include a liquid,such as water or a coolant fluid (not shown), such as a dielectricrefrigerant. The heat transferred from the heat plate 115 is absorbed bythe liquid in the evaporative region 120 causing the liquid to evaporateinto a vapor phase. The vapor carrying the transferred heat accumulatesand condenses in the condensing regions 125. In some implementations,the cooling system 105 may include a fill tube (not shown) which is usedin the manufacturing process to charge the cooling system 105 with acertain amount of liquid coolant or water. In some implementations, thevolume of coolant to be used may be a volume which occupies between 10%and 50% of the internal volume of the cooling system chamber. The weightor amount of liquid that may be used to charge the cooling system 105may be optimized or configured based on the power (and heat) map that isassociated with the ECP to which the cooling system 105 is coupled.

As shown in FIG. 1, the cooling system 105 also includes a plurality ofcondensing regions 125. The condensing regions 125 are the volumes ofspace formed by the walls of the condensing tubes 130. The condensingregions 125 accumulate the evaporated liquid which was transformed intovapor and carries the heat transferred from the heat transfer plate 115into the evaporative region 120. The vapor collects in the condensingregions 125 and condenses on the walls of the condensing tubes 130. Thedimensions of the condensing regions 125 and the condensing tubes 130from which they are formed may vary based on the heat transferperformance desired for a particular cooling system 105 and/orparticular ECP 110. In some implementations, the condensing tubes 130have a hydraulic diameter of approximately 2-15 mm and are approximately20-500 mm tall. The condensing tubes 130 may be circular, rectangular,triangular, octagonal or have any other cross sectional shape. In someimplementations, the condensing tubes 130 may be straight. In someimplementations, the condensing tubes 130 may be bent at an angle. Insome implementations, the condensing tubes 130 may be arrangedvertically in relation to the heat transfer plate 115. In someimplementations, the condensing tubes 130 may be arranged horizontallyin relation to the heat transfer plate 115.

The condensing tubes 130 may be constructed of a metal or metal alloywith desirable heat transfer qualities, such as copper or aluminum, sothat the heat that is present in the vapor which accumulates on thewalls of the condensing tubes 130 may be efficiently transferred to anexternal medium surrounding the condensing tubes 130 such as air orwater, allowing the vapor to condense back into a liquid phase. In someimplementations, the inner surface of the condensing tubes 130 mayinclude a coating, such as a copper powder coating. In otherimplementations, the inner surface of the condensing tubes 130 may befree of the copper powder coating, and may instead include a series oflongitudinal grooves that extend the length or substantially the entirelength of the condensing tubes 130.

As shown in FIG. 1, the cooling system 105 may include a plurality ofspacers 135. The spacers 135 are independent components spanning thespace within the evaporative region 120. The spacers 135 fill gapsbetween the between the heat transfer plate 115 and the respectivecondensing tubes 125. The spacers 135 are generally tubular and areconfigured to allow passage of fluid through the interior space of eachspacer. The spacers 135 may improve the overall dry-out power of thecondensing tube 130 to which it is attached by facilitating the flow ofcondensed evaporative liquid back toward the evaporative region 120. Insome implementations, the spacers 135 may include a rigid outerstructure such as a copper tube. In some implementations, the innersurface of the spacers 135 may include a coating to assist movement ofthe evaporative liquid back to the evaporative region 120. In someimplementations, the spacers 135 may include a mesh wick in addition tothe rigid outer structure. In some implementations, the spacers 135 mayinclude only a metal mesh spacer and do not include a rigid outerstructure.

As further shown in Figure, 1 the cooling system 105 includes aplurality of wicks 140. The wicks 140 provide a wicking (or capillary)effect to draw the condensed vapor that has accumulated at the lowerportion of the condensing tubes 130 back to the evaporative region 120.For example, as heat is transferred through the walls of the condensingtubes 130, the vapor that carried the heat condenses on the walls of thecondensing tubes 130 and migrates down the inner surface of thecondensing tubes. The condensed liquid may accumulate at the lowerportion of the condensing tubes 130. The wicks 140 may draw or wick theaccumulated liquid from the lower portion of the condensing tubes 130further down into the evaporative region near the heat transfer plate115. The wicks 140 may enable a steady, continuous flow of liquidcoolant through the cooling system 105 resulting in more uniformtemperatures and greater heat transfer performance in all condensingtubes 130 compared to cooling system designs that utilize condensingtubes without a wick. In some implementations, the wick 140 may beincluded as a component of the spacer 135. In other implementations, thewick 140 may not be included as a component of the spacer 135.

FIGS. 2A-2G describe multiple example configurations of spacers andwicks suitable for use in the cooling system shown 105 shown in FIG. 1.FIGS. 2A-2F show aspects of various implementations of the coolingsystem 105, including heat transfer plates 215 a-215 f, condensing tubes230 a-230 f, spacers 235 a-235 f, and wicks 240 a-240 f. FIG. 2G showsan implementation of a cooling system that includes all the elements ofFIGS. 2A-2F, but excludes a spacer.

As shown in FIG. 2A, the cooling system 105 includes a spacer 235 a thatis positioned at the lower portion of the condensing tube 230 a andextends at least partially into the corresponding condensing tube 230 a.The spacer 235 a spans substantially the entire evaporative region (e.g.between about 80%-100% of the gap between the end of the condensingtubes closest to the evaporator plate (referred to as the “proximalend”) and the heat transfer plate of the evaporative portion of thechamber) such that one end of the spacer 235 a is inserted into thecondensing tube 230 a, and the other end of the spacer 235 a is in closeproximity to or in contact with the heat transfer plate 215 a. In someimplementations, the inner surface of the spacer 235 a may include acoating to facilitate the return of the condensed liquid coolant back tothe evaporative region via the inner surfaces of the spacer 235 a. Forexample, the inner surface of the spacer 235 a may include a hydrophobicsurface coating to reduce the surface friction of the liquid coolant andmay facilitate movement of the liquid coolant from the condensing tube230 a back into the evaporative region of the cooling system 105.

As further shown in FIG. 2A, the spacer 235 a includes a wick 240 a. Thewick 240 a is positioned partially within the condensing tube 230 a towhich it is fluidically coupled. The wick 240 a is positioned within theinner volume of the spacer 235 a and extends upward to the lower portionof the condensing tube 230 a. The spacer 235 a extends downward towardthe heat transfer plate 215 a. The wick 240 a is in contact with theheat transfer plate 215 a. The portion of the wick 240 a in contact withthe heat transfer plate 215 a is oriented substantially parallel to theheat transfer plate 215 a for which it is in contact. In someimplementations, the portion of the wick 240 a in contact with the heattransfer plate 215 a may be configured to cover different crosssectional dimensions of the spacer 235 a to which it corresponds. Insome implementations, the portion of the wick 240 a that is orientedsubstantially parallel to the heat transfer plate 215 a, may coverbetween 15-30% of the cross sectional area of an end of thecorresponding spacer 235 a, for example 25% of the cross sectional areaof an end of the corresponding spacer 235 a. In some implementations,the portion of the wick 240 a that is oriented substantially parallel tothe heat transfer plate 215 a, may cover between 40-60% of the crosssectional area of an end of the corresponding spacer 235 a, for example50% of the cross sectional area of an end of the corresponding spacer235 a. In some implementations, the portion of the wick 240 a that isoriented substantially parallel to the heat transfer plate 215 a, maycover between 70-90% of the cross sectional area of an end of thecorresponding spacer 235 a, for example 75% of the cross sectional areaof an end of the corresponding spacer 235 a.

As shown in FIG. 2B, all of the elements described in relation to FIG.2A remain the same, except that the wick 240 b shown in FIG. 2B extendsbeyond the spacer 235 b and further into the proximal end of thecondensing tube 230 b. Extending the wick 240 b further into thecondensing region created by the condensing tube 230 b may provide agreater wicking effect and draw a greater amount of liquid coolant thathas condensed on the inner surfaces of the condensing tube 230 b backtoward the heat transfer plate 215 b. In some implementations, the wick240 b may extend into the proximal end of condensing tube 230 b for adistance that is between 0-10% of the length of the correspondingcondensing tube, for example less than 5% of the length of thecorresponding condensing tube. In some implementations, the wick 240 bmay extend into the proximal end of condensing tube 230 b for a distancethat is between 10-50% of the length of the corresponding condensingtube, for example 35% of the length of the corresponding condensingtube. In some implementations, the wick 240 b may extend into theproximal end of condensing tube 230 b for a distance that is between50-100% of the length of the corresponding condensing tube, for example75% of the length of the corresponding condensing tube.

As shown in FIG. 2C, all of the elements described in relation to FIG.2A remain the same, except that the spacer 235 c shown in FIG. 2C isconfigured to flare outward proximate to the heat transfer plate 215 c.For example, the diameter of the spacer proximate to the heat transferplate 215 c can be between 1.25-2.0 times the diameter of the spacerwhere it enters the condensing tube 230 c.

As shown in FIG. 2D, all of the elements described in relation to FIG.2C remain the same, except that the wick 240 d shown in FIG. 2D isconfigured to extend beyond the spacer 235 d and further into theproximal end of the condensing tube 230 d, similar to the wick 240 b asshown in FIG. 2B. In some implementations, the wick 240 d may extendinto the proximal end of condensing tube 230 d for a distance that isbetween 0-10% of the length or height of the corresponding condensingtube, for example less than 5% of the length of the correspondingcondensing tube. In some implementations, the wick 240 d may extend intothe proximal end of condensing tube 230 d for a distance that is between10-50% of the length or height of the corresponding condensing tube, forexample 35% of the length of the corresponding condensing tube. In someimplementations, the wick 240 d may extend into the proximal end ofcondensing tube 230 d for a distance that is between 50-95% of thelength or height of the corresponding condensing tube, for example 75%of the length of the corresponding condensing tube.

As shown in FIG. 2E, all of the elements described in relation to FIG.2A remain the same, except that as shown in FIG. 2E, the portion of thewick 240 e that is oriented substantially parallel to the heat transferplate 215 e extends to cover a smaller portion of the cross sectionalarea of an end of the corresponding spacer 235 e than the wick 240 ashown in FIG. 2A. For example, the portion of the wick 240 e that isoriented substantially parallel to the heat transfer plate 215 e mayextend to cover 5% of the cross sectional area of an end of the spacer235 e. In some implementations, the portion of the wick that is orientedsubstantially parallel to the heat transfer plate 215 e may extend tocover less, than 5%, less than 10%, or less than 20% of the crosssectional area of an end of the spacer 235 e. In some implementations,the wick shown in FIG. 2E may be configured within a flared spacer, suchas spacer 235 c of FIG. 2C. In some implementations, the wick 240 eshown in FIG. 2E may be configured to extend substantially into thecondensing tube 230 e as shown by the wick 240 b in FIG. 2B. In someimplementations, the wick 240 e of FIG. 2E may be configured in a flaredspacer, such as spacer 235 d in FIG. 2D and may be further configured toextend through the flared spacer substantially into the correspondingcondensing tube 230 e, such as the wick 240 d shown in FIG. 2D.

As shown in FIG. 2F, all of the elements described in relation to FIG.2A remain the same, except that as shown in FIG. 2F, a portion of thewick 240 f extends to cover an end of its corresponding spacer 235 f andfurther extends in a direction beyond an edge of the correspondingspacer 235 f. In some implementations, the portion of the wick 240 fthat is oriented substantially parallel to the heat transfer plate 215 fmay extend beyond an edge of the corresponding spacer 235 f byapproximately 0-10% of the width or diameter of the correspondingspacer. For example the portion of the wick 240 f that is orientedsubstantially parallel to the heat transfer plate 215 f may extendbeyond an edge of the corresponding spacer 235 f by approximately lessthan 5% of the width or diameter of the corresponding spacer 235 f. Insome implementations, the portion of the wick 240 f that is orientedsubstantially parallel to the heat transfer plate 215 f may extendbeyond an edge of the corresponding spacer 235 f by approximately 15-50%of the width or diameter of the corresponding spacer. For example theportion of the wick 240 f that is oriented substantially parallel to theheat transfer plate 215 f may extend beyond an edge of the correspondingspacer 235 f by approximately 45% of the width or diameter of thecorresponding spacer 235 f. In some implementations, the portion of thewick 240 f that is oriented substantially parallel to the heat transferplate 215 f may extend beyond an edge of the corresponding spacer 235 fby approximately 60-90% of the width or diameter of the correspondingspacer. For example the portion of the wick 240 f that is orientedsubstantially parallel to the heat transfer plate 215 f may extendbeyond an edge of the corresponding spacer 235 f by approximately 85% ofthe width or diameter of the corresponding spacer 235 f. In someimplementations, the wick shown in FIG. 2F may be configured within aflared spacer, such as spacer 235 c of FIG. 2C. In some implementations,the wick 240 f shown in FIG. 2F may be configured to extendsubstantially into the condensing tube 230 f as shown by the wick 240 bin FIG. 2B. In some implementations, the wick 240 f of FIG. 2F may beconfigured in a flared spacer, such as spacer 235 d in FIG. 2D, and maybe further configured to extend through the flared spacer substantiallyinto the corresponding condensing tube 230 f, such as the wick 240 dshown in FIG. 2D.

As shown in FIG. 2G, the wick 240 g is positioned similarly to the wick240 a described in FIG. 2A, however the cooling system 105 shown in FIG.2G excludes a spacer, such as the spacer 235 a shown in FIG. 2A. Thewick 240 g shown in FIG. 2G is configured positioned such that one endis in contact with the heat transfer plate 215 g and the opposite endextends into a proximal end of a corresponding condensing tube 230 g fora distance that is between 0-10% of the length or height of thecorresponding condensing tube, for example less than 5% of the length orheight of the corresponding condensing tube 230 g. In someimplementations, the wick 240 g may extend into the proximal end ofcondensing tube 230 g for a distance that is between 10-50% of thelength or height of the corresponding condensing tube, for example 40%of the length of the corresponding condensing tube. In someimplementations, the wick 240 g may extend into the proximal end ofcondensing tube 230 g for a distance that is between 50-100% of thelength or height of the corresponding condensing tube, for example 80%of the length of the corresponding condensing tube. In someimplementations, the wick 240 g includes a metal mesh wick. For example,the wick 140 may include a copper mesh wick. In some implementations,the wick 240 g includes a multi-layer metal mesh, such as a multi-layercopper mesh wick.

In some implementations, the portion of the mesh wick 240 g in contactwith the heat transfer plate 215 g may extend to cover a small portionof the cross sectional area of the condensing tube 230 g. For example,the portion of the wick 240 g that is oriented substantially parallel tothe heat transfer plate 215 g may extend to cover less than 5% of thecross sectional area of the condensing tube 230 g. In someimplementations, the portion of the wick that is oriented substantiallyparallel to the heat transfer plate 215 g may extend to cover 10-40% ofthe cross sectional area of the condensing tube 230 g, for example 25%of the cross sectional area of the condensing tube 230 g. In someimplementations, the portion of the wick that is oriented substantiallyparallel to the heat transfer plate 215 g may extend to cover 40-90% ofthe cross sectional area of the condensing tube 230 g, for example 75%of the cross sectional area of the condensing tube 230 g.

In some implementations, the portion of the wick 240 g that is orientedsubstantially parallel to the heat transfer plate 215 g extends to coveran end of its corresponding condensing tube 230 g and further extends ina direction beyond an edge of the corresponding condensing tube 230 g.In some implementations, the portion of the wick 240 g that is orientedsubstantially parallel to the heat transfer plate 215 g may extendbeyond an edge of the corresponding condensing tube 230 g byapproximately 0-10% of the width or diameter of the correspondingcondenser tube. For example the portion of the wick 240 g that isoriented substantially parallel to the heat transfer plate 215 g mayextend beyond an edge of the corresponding condensing tube 230 g byapproximately less than 5% of the width or diameter of the correspondingcondenser tube 230 g. In some implementations, the portion of the wick240 g that is oriented substantially parallel to the heat transfer plate215 g may extend beyond an edge of the corresponding condensing tube 230g by approximately 15-50% of the width or diameter of the correspondingcondenser tube. For example the portion of the wick 240 g that isoriented substantially parallel to the heat transfer plate 215 g mayextend beyond an edge of the corresponding condensing tube 230 g byapproximately 45% of the width or diameter of the correspondingcondenser tube 230 g. In some implementations, the portion of the wick240 g that is oriented substantially parallel to the heat transfer plate215 g may extend beyond an edge of the corresponding condensing tube 230g by approximately 60-90% of the width or diameter of the correspondingcondenser tube. For example the portion of the wick 240 g that isoriented substantially parallel to the heat transfer plate 215 g mayextend beyond an edge of the corresponding condensing tube 230 g byapproximately 85% of the width or diameter of the correspondingcondenser tube 230 g.

FIG. 3 is a top view of the example cooling system 105 shown in FIG. 1,illustrating an example arrangement 300 of condensing tubes 130 in anelectronic circuit package cooling system 105. The arrangement 300includes a plurality of condensing tubes 130 positioned about theperimeter of the upper surface 305 of the chamber or sealed enclosure ofthe cooling system 105. In some implementations, the positioning of thecooling tubes 130 may be determined in relation to a heat map or heatgeneration profile of the ECP to which the cooling system 105 isattached. For example, in some implementations, if the ECP generatesmore heat towards the center of the ECP, the plurality of condensingtubes 105 may be positioned towards the center of the chamber of thecooling system 105. In other implementations, the condensing tubes 130may be positioned in the corners or on opposite sides of the chamber ofthe cooling system 105.

FIG. 4 is a diagram of the electronic circuit package cooling systemillustrating an example arrangement 400 of grooved condensing tubes inan electronic circuit package cooling system 105 shown in FIG. 1. Asshown in FIG. 4, the cooling system 105 includes the same elements asthe cooling system 105 shown in FIG. 1, except that the inner surface ofeach condensing tube 130 includes a plurality of grooves 405. Theplurality of grooves 405 are oriented vertically within the condensingtubes 130 when the condensing tubes 130 are positioned atop the chamberof the cooling system 105 as shown in FIG. 4. In configurations wherethe condensing tubes are located on the sides of the chamber of thecooling system 105 (not shown), the plurality of grooves 405 may beoriented in a manner such that the grooves are parallel to the length ofthe condensing tubes 130. The grooves 405 that are in the inner walls ofthe condensing tubes 130 may provide a capillary effect for condensedliquid coolant and may act as channels for the flow of condensed liquidcoolant to return to the evaporative region 120, thereby reducing thecondensation fluid resistance on the inner surface of the condensingtube walls. By aiding the return of the liquid coolant to theevaporative region 120, the heat transfer performance of the coolingsystem 105 may be enhanced as the system is able to cycle the liquidcoolant more quickly from the evaporative region to the condensingregion and back again to the evaporative region.

A variety of groove configurations may be applied to the inner surfaceof the condensing tubes 130. In some implementations, the groove shapeor cross sectional profile of the grooves may be a rectangular shape, asquare shape, a rounded shape, and/or “v”-shape. In someimplementations, a mixture of groove shapes, depths and/or spacingconfigurations may be used within one or more condensing tubes 130 ofcooling system 105. In some implementations, the depth of each groovemay be between 0.05 mm to 1 mm. In some implementations, the spacingbetween each groove may be between 0.05 mm to 1 mm.

FIGS. 5A and 5B are diagrams of example configurations 500 a and 500 bof fins suitable for incorporation into an electronic circuit packagecooling system 105 shown in FIG. 1. As shown in FIG. 5A, theconfiguration 500 a includes a heat transfer plate, such as heattransfer plate 115 shown in FIG. 1. The heat transfer plate 115 includesa plurality of fins 505. The heat transfer plate 115 also includes oneor more coated fins 510. In broad terms, the plurality of fins 505 arefeatures of the cooling system 105 that are configured to furtherenhance the heat transfer performance of the cooling system 105. Asdescribed in relation to FIG. 1, the heat transfer plate 115 is coupledto an ECP such that the heat transfer plate 115 forms the floor or lowerportion of the evaporative region of the cooling system chamber. Asshown in FIG. 5A, the heat transfer plate 115 is configured with aplurality of fins 505 extending away from the heat transfer plate 115within the sealed enclosure or chamber of the cooling system 105. Thefins 505 may be configured on the heat transfer plate 115 such that theplurality of fins are uniformly arranged so that each fin 505 has thesame height, thickness, gap spacing, and orientation as other fins.

As further shown in FIG. 5A, the heat transfer plate 115 includes acoated fin 510. The uniform arrangement of fins 505 may include one ormore coated fins 510. The coating may include an evaporative surfacecoating, such as a copper powder that is sintered onto the surface ofthe fins 510. In some implementations, the coating thickness may be athickness between about 0.01 and about 1 mm. In some implementations,the particle size of the copper powder coating may be a particle sizebetween about 0.01 and about 0.2 mm. In some implementations, the coatedfins 510 may include other surface enhancements to further aid heattransfer performance, such as a metal mesh or surface roughness toincrease the surface area of the fin.

As shown in FIG. 5B, the configuration 500 b includes a heat transferplate, such as the heat transfer plate 115 of FIG. 1. The heat transferplate 115 includes a plurality of fins 515. The heat transfer plate alsoincludes one or more coated fins 520. As described in relation to FIG.5A, the arrangement and function of the plurality of fins that arepositioned on the heat transfer plate 115 may enhance the heat transferperformance of the cooling system 105. The plurality of fins 515includes fins that have an irregular shape. For example, as shown inFIG. 5B, the configuration 500 b includes a plurality of irregularlyshaped fins 515, which each have three ridges and a valley between tworidges. The fins 515 may be configured on the heat transfer plate 115such that the plurality of irregularly shaped fins 515 have differentheights, thicknesses, gap spaces, and/or orientations. In someimplementations, the irregular arrangement of the fins 515 may beconfigured based on the heat map or heat generation profile of the ECPto which the heat transfer plate 115 is attached.

As further shown in FIG. 5B, the heat transfer plate 115 includes acoated fin 520 having an irregular arrangement. For example, theirregular arrangement of fins 515 may include one or more coated fins520. The coating may include an evaporative surface coating, such as acopper powder that is sintered onto the surface of the fins 520. In someimplementations, the coating thickness may be a thickness between about0.01 and about 1 mm. In some implementations, the particle size of thecopper powder coating may be a particle size between about 0.01 andabout 0.2 mm. The irregular arrangement of the coated fins 520 may beconfigured based on the heat map or heat generation profile of the ECPto which the heat transfer plate 115 is attached so that the heattransfer plate 115 includes a greater density of fins or great finsurface area directly over the regions of the ECP which generate themost heat. For example, the heat generation profile of the ECP to whichthe heat transfer plate 115 is coupled may include three distinctregions which generate high heat and thus require greater heat transferto maintain proper operating conditions of the ECP components.Accordingly, the heat transfer plate 115 may be configured such that theplurality of irregular shaped fins 515 are arranged with greater finheight, thickness and/or density directly over the three highest heatproducing regions. As shown in FIG. 5B, the three ridges of eachirregularly shaped fin 515 may correspond to the three highest heatproducing regions of the ECP, while the two valleys of each irregularlyshaped fin 515 may correspond to lower heat producing regions of theECP. In some implementations, the coated fins 520 may include othersurface enhancements to further aid heat transfer performance, such as ametal mesh or surface roughness to increase the surface area of the fin.

FIG. 6 is a diagram of an example coating configuration 600 within theevaporative region of an electronic circuit package cooling system, suchas the cooling system 105 shown in FIG. 1. As shown in FIG. 6, thecooling system 105 includes a coating 605. The coating 605 is includedon the surfaces of each of the inner walls of the chamber formingevaporative region 120. The coating 605 may be an evaporative surfacecoating, such as a copper powder that is sintered onto the inner wallsurface of the chamber forming the evaporative region 120. The coating605 may enhance the heat transfer performance of the cooling system 105by improving the evaporative efficiency of the heat transfer plate 115and the inner wall surfaces of the chamber forming the evaporativeregion 120 to which the coating 605 is applied. The coating may includean evaporative surface coating, such as a copper powder that is sinteredonto the inner surface of the walls of the chamber forming theevaporative region 120. In some implementations, the coating thicknessmay be a thickness between about 0.01 and about 1 mm. In someimplementations, the particle size of the copper powder coating may be aparticle size between about 0.01 and about 0.2 mm. In someimplementations, the inner surface of the walls of the chamber formingthe evaporative region 120 may include other surface enhancements, suchas a metal mesh or surface roughness to increase the surface area of thewall surfaces and further enhance the heat transfer performance of theevaporative region 120.

FIG. 7 is also a diagram of an example coating configuration 700 withinthe evaporative region of an electronic circuit package cooling system105 shown in FIG. 1. As shown in FIG. 7, the cooling system 105 includesa coating 705 applied to the surface of the heat transfer plate 115 andalso includes a coating 710 applied to the upper portion of the chamberforming the evaporative region 120. The coating 705 is included on thesurface of the heat transfer plate 115 and covers the heat transferplate 115 from one side of the evaporative region 120 to the other sideof the evaporative region 120. The coating 710 is included on the innersurface wall of the upper portion of the chamber forming the evaporativeregion 120. The coating, 705 and/or 710, may be an evaporative surfacecoating, such as a copper powder that is sintered onto the inner wallsurface of the chamber forming the evaporative region 120. The coating705 and/or 710 may enhance the heat transfer performance of the coolingsystem 105 by improving the absorption of heat from the heat transferplate 115 and improving the evaporative function of upper portion of thechamber forming the evaporative region 120. The coating 705 and/or 710may include an evaporative surface coating, such as a copper powder thatis sintered onto the inner surface of the walls of the chamber formingthe evaporative region 120. In some implementations, the thickness ofcoating 705 and/or 710 may be a thickness between about 0.01 and about 1mm. In some implementations, the coating particle size may be a particlesize between about 0.01 and about 0.2 mm. In some implementations, theinner surface of the walls of the chamber forming the evaporative region120 may include other surface enhancements, such as a metal mesh orsurface roughness to increase the surface area of the wall surfaces andfurther enhance the heat transfer performance of the evaporative region120.

FIG. 8 is a diagram of an example coating configuration 800 within thecondensing region of an electronic circuit package cooling system, suchas the cooling system 105 shown in FIG. 1. As shown in FIG. 8, thecooling system 105 includes a coating 805. The coating 805 is includedon the inner surfaces of the condensing tubes 130. The coating 805 maybe a hydrophobic surface coating which functions to reduce the surfacefriction of the liquid coolant condensed on the inner surface of thewalls of the condensing tubes 130. By reducing the surface friction, thecoating 805 may facilitate the movement of the condensed liquid coolantback into the evaporative region of the cooling system 105. For example,the coating 805 may be a surface coating, such as a sintered copperpowder. The sintered copper powder may include powder particle sizesbetween 0.01 mm and 0.5 mm. The sintered copper power may be sintered onthe inner surface of the condensing tubes 130 to form a surface coatingwith a thickness between 0.01 mm and 2.0 mm. In some implementations,the condensing tubes 130 may include both a coating 805 and a pluralityof grooves, such as the grooves 405 as shown in FIG. 4. For example, thecoating 805 may be applied to the inner surface of the condensing tubewalls after a plurality of grooves has been formed on the inner wallsurfaces of the condensing tubes 130.

While this specification contains many specific implementation details,these should not be construed as limitations on the scope of anyinventions or of what may be claimed, but rather as descriptions offeatures specific to particular implementations of particularinventions. Certain features that are described in this specification inthe context of separate implementations can also be implemented incombination in a single implementation. Conversely, various featuresthat are described in the context of a single implementation can also beimplemented in multiple implementations separately or in any suitablesub-combination. Moreover, although features may be described above asacting in certain combinations and even initially claimed as such, oneor more features from a claimed combination can in some cases be excisedfrom the combination, and the claimed combination may be directed to asub-combination or variation of a sub-combination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. In certain circumstances, multitasking and parallel processingmay be advantageous. Moreover, the separation of various systemcomponents in the implementations described above should not beunderstood as requiring such separation in all implementations, and itshould be understood that the described program components and systemscan generally be integrated together in a single software product orpackaged into multiple software products.

References to “or” may be construed as inclusive so that any termsdescribed using “or” may indicate any of a single, more than one, andall of the described terms. The labels “first,” “second,” “third,” andso forth are not necessarily meant to indicate an ordering and aregenerally used merely to distinguish between like or similar items orelements.

Various modifications to the implementations described in thisdisclosure may be readily apparent to those skilled in the art, and thegeneric principles defined herein may be applied to otherimplementations without departing from the spirit or scope of thisdisclosure. Thus, the claims are not intended to be limited to theimplementations shown herein, but are to be accorded the widest scopeconsistent with this disclosure, the principles and the novel featuresdisclosed herein.

What is claimed is:
 1. A cooling system for an electronic circuitpackage, comprising: a heat transfer plate positioned in thermal contactwith an electronic circuit package surface, wherein the heat transferplate forms a bottom surface of an evaporative region of the coolingsystem; a plurality of condensing tubes in fluid communication with, andextending away from, the evaporative region, such that the evaporativeregion and condensing tubes together form a single, uninterrupted,sealed enclosure, wherein each of the plurality of condensing tubesincludes a plurality of grooves; a fluid disposed within the sealeddisclosure; and a plurality of wicks, each wick positioned such that oneend is in contact with the heat transfer plate and an opposite endextends into a proximal end of a corresponding condensing tube for adistance that is less than 5% of the length of the correspondingcondensing tube.
 2. The cooling system of claim 1, wherein each wickcomprises a multi-layer copper mesh.
 3. The cooling system of claim 1,wherein at a least a portion of each wick contacts the heat transferplate.
 4. The cooling system of claim 3, wherein the portion of eachwick in contact with the heat transfer plate is oriented substantiallyparallel to the heat transfer plate.
 5. The cooling system of claim 3,wherein the portion of each wick in contact with the heat transfer platecovers less than three-quarters of a cross sectional area of an end of acorresponding condensing tube.
 6. The cooling system of claim 3, whereinthe portion of each wick in contact with the heat transfer platesubstantially covers an end of its corresponding condensing tube andextends in a direction parallel to the heat transfer plate beyond anedge of the corresponding condensing tube.
 7. The cooling system ofclaim 1, wherein each wick comprises a metal mesh.
 8. The cooling systemof claim 1, wherein the heat transfer plate comprises a plurality offins extending away from the heat transfer plate within the sealedenclosure.
 9. The cooling system of claim 8, wherein the plurality offins are arranged in an irregular fashion.
 10. The cooling system ofclaim 9, wherein the plurality of fins are arranged based on a variationin heat generation across the electronic circuit package surface inthermal contact with the heat transfer plate.
 11. The cooling system ofclaim 1, wherein at least a portion of the sealed enclosure is coatedwith a copper powder.
 12. The cooling system of claim 11, wherein thecopper powder has a particle size of about 0.1 mm.
 13. The coolingsystem of claim 11, wherein the copper powder forms a coating having athickness of about 0.3 mm.
 14. The cooling system of claim 13, whereinthe copper powder coating coats a plurality of fins extending away fromthe heat transfer plate within the sealed enclosure.
 15. The coolingsystem of claim 13, wherein the copper powder coating coats at least oneof the heat transfer plate and a surface of the evaporative regionopposite the heat transfer plate within the sealed enclosure.
 16. Thecooling system of claim 11, wherein the interiors of the condensingtubes are free from the copper powder coating.
 17. The cooling system ofclaim 1, wherein the condensing tubes are positioned about a perimeterof the sealed enclosure.